Micron – Elite Memory Solutions LLP

Micron's HBM3E helps reduce data center operating costs by consuming about 30% less power than competing offerings. The 8-high 24GB solution will be part of NVIDIA H200 Tensor Core GPUs which will begin shipping in the second calendar quarter of 2024.

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MTC40F2047S1HC88XB1

MRDIMM Part - MTC40F2047S1HC88XB1

Component Density - 128Gb
MT/s - 8800MTPS
Operating Temp - 0C to +95C
Technology - DDR5 SDRAM
Family - DRAM
Package - VFBGA
Module Version - MRDIMM
Module Density - 128GB
Package Type - GREEN
Number of Components - 40
Bus Width - x80
Component Config -8G x4
CAS Latency - CL = 36

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MTA36ASF4G72PZ-2G6E1

HBM3E

MTC40F2047S1HC88XB1

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