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H5ANBG6NAMR-XNC
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H5ANBG6NAMR-XNC

DDR4
  • Density - 32Gb
  • Speed - 3200Mbps
  • Organization - x16
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.2
  • Package - FBGA
  • Product Status - MP
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H5CG48MEBDX014N
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H5CG48MEBDX014N

DDR5
  • Density - 16Gb
  • Speed - 4800Mbps
  • Organization - x8
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.1
  • Package - FCBGA
  • Product Status - MP
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HBM3E
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HBM3E

Micron's HBM3E helps reduce data center operating costs by consuming about 30% less power than competing offerings. The 8-high 24GB solution will be part of NVIDIA H200 Tensor Core GPUs which will begin shipping in the second calendar quarter of 2024.
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MTC40F2047S1HC88XB1
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MTC40F2047S1HC88XB1

MRDIMM Part - MTC40F2047S1HC88XB1
  • Component Density - 128Gb
  • MT/s - 8800MTPS
  • Operating Temp - 0C to +95C
  • Technology - DDR5 SDRAM
  • Family - DRAM
  • Package - VFBGA
  • Module Version - MRDIMM
  • Module Density - 128GB
  • Package Type - GREEN
  • Number of Components - 40
  • Bus Width - x80
  • Component Config -8G x4
  • CAS Latency - CL = 36
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H5CG48AGBDX018N
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H5CG48AGBDX018N

DDR5
  • Density - 16Gb
  • Speed - 5600Mbps
  • Organization - x8
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.1
  • Package - FCBGA
  • Product Status - MP
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H5WRAGESM8W-N8L
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H5WRAGESM8W-N8L

HBM2E
  • Density - 16Gb
  • KGSD Density - 128Gb
  • Speed - 3.6Gbps
  • Organization x1024
  • Voltage (VDD / VDDQ)- 1.2V / 1.2V
  • Package - 8Hi
  • Product Status - MP
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H5UG7HME03X020R
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H5UG7HME03X020R

HBM3
  • Density - 16Gb
  • KGSD Density - 128Gb
  • Speed - 6.0Gbps
  • Organization x1024
  • Voltage (VDD / VDDQ)- 1.1V / 1.1V
  • Package - 8Hi
  • Product Status - CS
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H58G76BK8HX095N
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H58G76BK8HX095N

LPDDR5T/5X
  • Density - 16Gb
  • Voltage (VDD / VDD2 / VDDQ) - 1.8V / 1.05V / 0.5V
  • Speed - 8533Mbps
  • Organization -x16
  • Temperature-25~105C
  • Package - 496Ball
  • Product Status - CS
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K3KL4L40EM-JFCU
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K3KL4L40EM-JFCU

  • Density - 96 GB
  • Organization - x64
  • Speed - 8533 Mbps
  • Voltage - 1.8 / 1.05 / 0.9 / 0.5 V
  • Temperature - -40 ~ 95 °C
  • Package - 441 FBGA
  • Product Status - Sample
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K3KL1L10GM-JFCT
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K3KL1L10GM-JFCT

  • Density - 32 GB
  • Organization - x64
  • Speed - 7500 Mbps
  • Voltage - 1.8 / 1.05 / 0.9 / 0.5 V
  • Temperature - -40 ~ 95 °C
  • Package - 441 FBGA
  • Product Status - Mass Production
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HMCG66AGBUA081N
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HMCG66AGBUA081N

DDR5 Module UDIMM
  • Density - 8Gb
  • Organization - x16
  • Speed - 5600Mbps
  • Package Type - SDP
  • Product Status - MP
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HMCG88MEBUA081N
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HMCG88MEBUA081N

  • Density - 32Gb
  • Organization - x8
  • Speed - 4800Mbps
  • Package Type - SDP
  • Product Status - CS
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MT60B1G16HC-48B:A
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MT60B1G16HC-48B:A

  • Component Density - 16Gb
  • MT/s - 4800MTPS
  • Operating Temp - 0C to +95C
  • Technology - DDR5 SDRAM
  • Family - DRAM
  • Pin Count - 102-ball
  • Package - VFBGA
  • I/O Voltage - 1.1V
  • Package Type - GREEN
  • Number of Components - 1
  • Bus Width - x16
  • Component Config -1G x16
  • Speed - 2400MHz
  • CAS Latency - CL = 40
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KHAA84901B-JC17
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KHAA84901B-JC17

  • Density - 16 GB
  • Organization - 1024
  • Speed - 3.6 Gbps
  • Refresh- 32ms
  • Package - MPGA
  • Product Status - Mass Production
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KHAA84901B-MC17
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KHAA84901B-MC17

  • Density - 16 GB
  • Organization - 1024
  • Speed - 3.6 Gbps
  • Refresh- 32ms
  • Package - MPGA
  • Product Status - Mass Production
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KHAA44801B-MC17
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KHAA44801B-MC17

  • Density - 8 GB
  • Organization - 1024
  • Speed - 3.6 Gbps
  • Refresh- 32ms
  • Package - MPGA
  • Product Status - Mass Production
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