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  • Micron
MTFC256GBCAQTC-AAT
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MTFC256GBCAQTC-AAT

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e.MMC Part - MTFC256GBCAQTC-AAT
  • Operating Temp - -40C to +105C
  • Protocol - MMC5.1
  • Technology - MASSFLASH/CONTROLLER
  • Family - MCP
  • PLP - NO
  • Pin Count - 153-ball
  • Package Type - GREEN
  • I/O Voltage - 1.8V
  • Component Config - 256G x8
  • Capacity - 256GB
MT62F768M64D4EK-023 FAAT:B
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MT62F768M64D4EK-023 FAAT:B

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LPDDR5X Part - MT62F768M64D4EK-023 FAAT:B
  • Component Density - 48Gb
  • MT/s - 8533MTPS
  • Operating Temp - -40C to +105C
  • Technology - LPDDR5
  • Family - DRAM
  • Package - TFBGA
  • PLP - NO
  • Pin Count - 441-ball
  • Package Type - GREEN
  • I/O Voltage - 0.5V
  • Number of Components - 4
  • Bus Width - x64
  • Speed - 4266MHz
  • Component Config - 768M x64
  • CAS Latency - CL = Programmable
MTA36ASF4G72PZ-2G6E1
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MTA36ASF4G72PZ-2G6E1

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RDIMM Part - MTA36ASF4G72PZ-2G6E1
  • Component Density - 35Gb
  • MT/s - 2666MTPS
  • Operating Temp - 0C to +95C
  • Technology - DDR4 SDRAM
  • Family - DRAM
  • Package - TFBGA
  • Module Version - RDIMM
  • Module Density - 32GB
  • Package Type - GREEN
  • Number of Components - 36
  • Bus Width - x72
  • Speed - 1333MHz
  • Component Config -2G x4
  • CAS Latency - CL = 19
H26M74002HMR
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H26M74002HMR

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eMMC 5.1
  • Model Name - EE510
  • Density - 64Gb
  • Mono-Density - 128Gb
  • PKG Size - 11.5x13x1.0mm
  • PKG Type - FBGA
  • Spec - eMMC 5.1
  • Product Status - MP
H26M41208HPR
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H26M41208HPR

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eMMC 5.1
  • Model Name - EE510
  • Density - 8Gb
  • Mono-Density - 64Gb
  • PKG Size - 11.5x13x0.8mm
  • PKG Type - FBGA
  • Spec - eMMC 5.1
  • Product Status - MP
H54GG6AYRHX263
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H54GG6AYRHX263

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LPDDR LPDDR4X
  • Density - 12Gb
  • Voltage (VDD1 / VDD2 / VDDQ) - 1.8V / 1.1V / 0.6V
  • Speed - 4266Mbps
  • Organization -x16
  • Temperature-25~105C
  • Package - 556Ball
  • Product Status - MP
H9JKNNNFB3AECR-N6H
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H9JKNNNFB3AECR-N6H

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LPDDR LPDDR5
  • Density - 8Gb
  • Voltage (VDD1 / VDD2 / VDDQ) - 1.8V / 1.05V / 0.5V
  • Speed - 6400Mbps
  • Organization -x16
  • Temperature-30~105C
  • Package - 496Ball
  • Product Status - MP
H5ANAG6NCJR-XNC
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H5ANAG6NCJR-XNC

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DDR4
  • Density - 16Gb
  • Speed - 3200Mbps
  • Organization - x16
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.2
  • Package - FCBGA
  • Product Status - MP
H5ANBG6NAMR-XNC
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H5ANBG6NAMR-XNC

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DDR4
  • Density - 32Gb
  • Speed - 3200Mbps
  • Organization - x16
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.2
  • Package - FBGA
  • Product Status - MP
H5CG48MEBDX014N
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H5CG48MEBDX014N

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DDR5
  • Density - 16Gb
  • Speed - 4800Mbps
  • Organization - x8
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.1
  • Package - FCBGA
  • Product Status - MP
HBM3E
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HBM3E

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Micron's HBM3E helps reduce data center operating costs by consuming about 30% less power than competing offerings. The 8-high 24GB solution will be part of NVIDIA H200 Tensor Core GPUs which will begin shipping in the second calendar quarter of 2024.
MTC40F2047S1HC88XB1
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MTC40F2047S1HC88XB1

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MRDIMM Part - MTC40F2047S1HC88XB1
  • Component Density - 128Gb
  • MT/s - 8800MTPS
  • Operating Temp - 0C to +95C
  • Technology - DDR5 SDRAM
  • Family - DRAM
  • Package - VFBGA
  • Module Version - MRDIMM
  • Module Density - 128GB
  • Package Type - GREEN
  • Number of Components - 40
  • Bus Width - x80
  • Component Config -8G x4
  • CAS Latency - CL = 36
H5CG48AGBDX018N
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H5CG48AGBDX018N

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DDR5
  • Density - 16Gb
  • Speed - 5600Mbps
  • Organization - x8
  • Temperature - 0~85C
  • Voltage (VDD / VDDQ)- 1.1
  • Package - FCBGA
  • Product Status - MP
H5WRAGESM8W-N8L
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H5WRAGESM8W-N8L

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HBM2E
  • Density - 16Gb
  • KGSD Density - 128Gb
  • Speed - 3.6Gbps
  • Organization x1024
  • Voltage (VDD / VDDQ)- 1.2V / 1.2V
  • Package - 8Hi
  • Product Status - MP
H5UG7HME03X020R
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H5UG7HME03X020R

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HBM3
  • Density - 16Gb
  • KGSD Density - 128Gb
  • Speed - 6.0Gbps
  • Organization x1024
  • Voltage (VDD / VDDQ)- 1.1V / 1.1V
  • Package - 8Hi
  • Product Status - CS
H58G76BK8HX095N
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H58G76BK8HX095N

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LPDDR5T/5X
  • Density - 16Gb
  • Voltage (VDD / VDD2 / VDDQ) - 1.8V / 1.05V / 0.5V
  • Speed - 8533Mbps
  • Organization -x16
  • Temperature-25~105C
  • Package - 496Ball
  • Product Status - CS
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